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This SAE Recommended Practice provides supporting information for the emission and immunity measurement procedures defined in the SAE J1752 series of documents.

This measurement procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a TEM or wideband TEM (GTEM) cell. The test board is not in the cell as in the conventional usage but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured RF voltage is affected by the septum to test board (wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to wall spacing of 45 mm and a GTEM cell with average septum to wall spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations.

This measurement procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a TEM or wideband TEM (GTEM) cell. The test board is not in the cell as in the conventional usage but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured RF voltage is affected by the septum to test board (wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to wall spacing of 45 mm and a GTEM cell with average septum to wall spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations.

This measurement procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a TEM or wideband TEM (GTEM) cell. The test board is not in the cell as in the conventional usage but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured RF voltage is affected by the septum to test board (wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to wall spacing of 45 mm and a GTEM cell with average septum to wall spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations.

This SAE Recommended Practice specifies measurement procedures and performance levels for magnetic and electric field emissions and conducted power mains emissions over the frequency range 150 kHz to 30 MHz, for vehicles incorporating electric propulsion systems, e.g., battery, hybrid, or plug-in hybrid electric vehicles. Conducted emission measurements in this document are applicable only to battery-charging systems which utilize a switching frequency above 9 kHz, are mounted on the vehicle, and whose power is transferred by metallic conductors. Conducted emission requirements apply only during charging of the batteries from AC power lines. Conducted and radiated emissions measurements of battery-charging systems that use an induction power coupling device are not covered by this document. The measurement of electromagnetic disturbances for frequencies from 30 MHz to 1000 MHz is covered in CISPR 12.

This SAE Standard specifies the test methods and procedures necessary to evaluate electrical components intended for automotive use to the threat of Electrostatic Discharges (ESDs). It describes test procedures for evaluating electrical components on the bench in the powered mode and for the packaging and handling non-powered mode. A procedure for calibrating the simulator that is used for electrostatic discharges is given in Appendix A. An example of how to calculate the RC Time Constant is given in Appendix B Functional Performance Status Classifications for immunity to ESD and Sensitivity classifications for ESD sensitive devices are given in Appendix C.

This SAE Standard specifies the test methods and procedures necessary to evaluate electrical components intended for automotive use to the threat of Electrostatic Discharges (ESDs). It describes test procedures for evaluating electrical components on the bench in the powered mode and for the packaging and handling non-powered mode. A procedure for calibrating the simulator that is used for electrostatic discharges is given in Appendix A. An example of how to calculate the RC Time Constant is given in Appendix B Functional Performance Status Classifications for immunity to ESD and Sensitivity classifications for ESD sensitive devices are given in Appendix C.